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C-TECH晶振解答你关于SAW滤波器的十万个为什么

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浏览：- 发布日期：2023-10-19 16:04:09【大中小】

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C-TECH是一家领先的制造和开发公司，自1997年成立以来，主要研发生产销售SAW滤波器业务，至今已超过20年。C-TECH采用优异的原料，先进的技术设备生产，产品品质和经验丝毫不输同行。C-TECH晶振正在开发一种半导体工艺，可以独立完成制造和组装。凭借积累的技术和知识，我们提供定制开发根据客户要求的规格。

基于ISO 9001和ISO 14001的可靠性，声表面波滤波器开发和生产本身就是生产CDMA / LTE / 5G移动中继、国防工业、基站、收音机、无线寻呼机、无线麦克风、调频、DMB、GPS、WiFi、高通、蓝牙、IOT等正在被应用到无线业务的各个领域。下面C-TECH对自己精心钻研的产品SAW FILTER声表面滤波器进行详细介绍。

声表面波滤波器（表面声波）是使用表面声波控制信号频率分量和相位分量，以消除相邻信道信号，它是一个带通滤波器（BPF），对接收信道信号进行整形。

SAW滤波器的工作原理

当梳状电极(IDT)形成在压电基板的两侧并且电信号施加到输入端时，沿衬底表面传播的表面声波(SAW)由压电效应产生，并在输出端转换回电信号。这些SAW器件的频率特性由IDT电极的几何结构决定。

SAW滤波器制造工艺

FAB

Process	Equipment	Description
WAFER Cleaning	Wet Station Rinse & Drier	Process to remove foreign substances causing short circuit defects on the wafer surface before AI deposition and to increase adhesion between the wafer surface and AL
Sputtering	Sputter T/Profiler	Process for depositing AL on wafer surface to desired height
P.R Coating	Coater	Process for applying photo Resist on AL
Exposing	Aligner Stepper	First step process of pattern formation by irradiating UV on PR through MASK
Developing	Developer Scope	Process of removing UV irradiated PR for AL Etching after Exposing
Etching	Wet Station Rinse & Drier	Process of implementing the final pattern by removing the AL in each selected manner
Stripping	Wet Station Rinse & Drier	Process for removing PR that protects AL patterns
Auto Probing	Auto Prober Dry Oven	Process for determining good and bad products by measuring metod before puttiong the products divided into cells of the wafer into assembly

Assembl

Process	Equipment	Description
Absorber Coating	Screen Printer Dry Oven	Process of applying an absorber to each cell to improve the characteristics of the output to the measuring device
Dicing	Tape Mounter Dicing SAW Cleaner	Process of cutting each cell of the wafer based on the Dicing Line
Die Bonding	Die bonder Epoxy Dispenser UV,Dry Oven	Process of bonding base and chip by applying epoxy
Wire Bonding	Wire Bonder	The Process of connecting the terminal of the BASE and the PAD of the CHIP to transmit an electrical signal to the AL wire
Can Sealing	Spot Welder Seam Sealer Dry Oven	Welding Process using Lid & Cap to protect the chip
Marking	Laser Maker	Process of laser marking the product’s unique model name and data code
Testing	Network Analyzer	Process for final inspection of product defects
Q.C	Network Analyzer	Process of sampling and inspection of mixed or defective products
Packing	Tape & Reel	Q.C process for packaging completed products
Shipping		Shipment of all process and packaged products