全站搜索 - 13 - 有源晶振,TCXO晶振,石英晶体谐振器,石英晶体振荡器

: RSM200S-32.768-12.5-15PPM-NPB,RSM200S无源晶振,8038贴片晶振

RSM200S-32.768-12.5-15PPM-NPB,RSM200S无源晶振,8038贴片晶振,该晶振标准频率为32.768kHz,适配12.5pF负载电容,频率精度可达±15PPM,频率稳定性优异,可有效保障设备时钟计时,数据时序的精准输出.产品采用8.0*3.8mm标准8038贴片封装,体积小巧,贴合主流贴片焊接工艺,适配自动化SMT生产,大幅提升生产效率.同时具备宽温工作特性,可在-40℃至+85℃严苛温度环境下稳定运行,抗老化,抗干扰能力突出,功耗极低,适配各类低功耗电子设备.深圳市亿金电子作为Raltron品牌正规代理,原装正品供货,品质可控,全程保障产品性能稳定,欢迎各界客户来电咨询选型.
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: Q13MC3062003600,MC-306陶瓷晶振,低功耗计时设备晶振

Q13MC3062003600,MC-306陶瓷晶振,低功耗计时设备晶振,采用主流8038贴片晶振封装,尺寸8.0×3.8×2.54mm,四脚无源贴片结构,标配32.768kHz基准频率,专为各类低功耗计时设备量身打造.依托爱普生精密音叉晶体工艺,产品频率公差稳定,年老化率极低,长期待机运行几乎无频偏误差,完美适配设备长期休眠守时,定时唤醒,数据计时等核心功能.具备超低工作功耗,大幅降低电池供电设备能耗,有效延长设备续航时间.工业宽温覆盖-40℃~+85℃,温漂控制优异,陶瓷密封结构抗震防潮,适配SMT自动化生产,符合RoHS环保标准,广泛应用于各类智能低功耗计时终端设备.我司原厂直供,现货充足,可提供试样,规格书及全套资质,批量交期稳定.
13-4b95-859e-64cbc7ca530b","mention_page_title":{},"external_mention_url":{}},"isKeepQuoteContainer":false,"isFromCode":false,"selection":[{"id":5,"type":"text","selection":{"start":47,"end":258},"recordId":"P2m7fM0c3dSsg8cdxnmcypkInqd"}],"payloadMap":{},"isCut":false}' data-lark-record-format="docx/text">

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: CPFBZ-A2C5-32.768KD6,8038封装晶振,32.768kHz晶振

CPFBZ-A2C5-32.768KD6,8038封装晶振,32.768kHz晶振,凭借6pF通用负载,±20ppm精准度,宽温稳定工作的核心优势,成为电子设备RTC实时时钟的核心配套器件.小型化贴片结构精简设备内部空间,盘带包装适配自动化量产产线,有效提升产品组装效率,降低生产成本.器件低功耗,高稳定性的特性,完美适配电池供电,长期待机的智能终端设备,可有效改善产品计时不准,待机耗电快等问题.

13-4b95-859e-64cbc7ca530b","mention_page_title":{},"external_mention_url":{}},"isKeepQuoteContainer":false,"isFromCode":false,"selection":[{"id":5,"type":"text","selection":{"start":47,"end":258},"recordId":"P2m7fM0c3dSsg8cdxnmcypkInqd"}],"payloadMap":{},"isCut":false}'>

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: Q13MC3061001800晶振,MC-306晶振,8038晶振

Q13MC3061001800晶振,MC-306晶振,8038晶振,32.768kHz音叉谐振器,尺寸8.0×3.8mm,负载12.5pF,精度±10ppm,工作温度-40℃~+85℃.原厂标准卷带包装,支持SMT全自动贴片,符合RoHS环保规范.具备低功耗,起振稳定,抗环境干扰等特性,广泛用于智能表计,物联网模块,消费电子主板RTC电路.货源稳定可持续供货,可提供样品测试与原厂规格书,满足研发试样与大批量生产采购需求.

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: ABM8G-25.000MHz18-D2Y-T,医疗设备晶振,Abracon工业应用晶振

ABM8G-25.000MHz18-D2Y-T,医疗设备晶振,Abracon工业应用晶振,尺寸3.2×2.5×1.0mm超薄四脚贴片,专为心电监护仪,血氧检测仪等医疗设备设计25MHz基准时钟.负载电容18pF,常温公差±20ppm,全温稳定度±30ppm,工作温域-40℃~85℃,病房恒温,消毒高温环境下频漂控制严格,年老化率仅±3ppm,长期运行数据采样时序无偏差.玻璃真空密封封装绝缘性强,500MΩ高绝缘电阻,规避医疗设备电磁干扰,保障生命体征数据采集精准.支持标准无铅回流焊,卷带量产适配医用设备自动化产线,适配多参数监护仪,便携式输液控制主板.

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: Q22FA23V00418,EPSON爱普生晶振,3225工业设备晶振

Q22FA23V00418,EPSON爱普生晶振,3225工业设备晶振,3225标准化封装兼顾成本与工业级可靠性,12MHz精准频点适配工业仪表,远程数据终端,温控采集模块.器件采用AT切割石英晶片,低温与高温环境下振荡稳定性优异,-40℃至85℃全程稳定起振,±20ppm高频率精度满足工业数据同步标准.低ESR阻抗设计降低振荡功耗,适配电池供电便携式工业检测仪,全密封金属基底快速导出热量,减少高温积热带来的频率漂移.

13-4b95-859e-64cbc7ca530b","mention_page_title":{},"external_mention_url":{}},"isKeepQuoteContainer":false,"isFromCode":false,"selection":[{"id":5,"type":"text","selection":{"start":47,"end":258},"recordId":"P2m7fM0c3dSsg8cdxnmcypkInqd"}],"payloadMap":{},"isCut":false}' data-lark-record-format="docx/text">

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: 656L30005C3,CTS西迪斯晶振,LVDS差分有源晶振

656L30005C3,CTS西迪斯晶振,LVDS差分晶振,300MHz基准频点完美匹配PCIe,万兆以太网,光纤通道硬件时序需求.差分互补信号输出可抵消线路共模干扰,长走线时钟信号完整性出色,无需额外信号缓冲,简化PCB布线设计.低摆幅LVDS架构运行功耗更低,相比LVPECL方案整机发热更少,长期7×24小时连续运行老化漂移微弱.陶瓷气密封装隔绝粉尘水汽,机械结构坚固抗震动,适配机架式交换机,工业测试仪器长期值守工况.出厂完成温循,振动,EMC多重可靠性筛选,批次参数一致性高,符合RoHS无铅环保规范,多用于数据中心交换设备,宽带接入网关,高速图像采集主板.

13-4b95-859e-64cbc7ca530b","mention_page_title":{},"external_mention_url":{}},"isKeepQuoteContainer":false,"isFromCode":false,"selection":[{"id":5,"type":"text","selection":{"start":47,"end":258},"recordId":"P2m7fM0c3dSsg8cdxnmcypkInqd"}],"payloadMap":{},"isCut":false}' data-lark-record-format="docx/text">

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: 7W-12.288MBE-T,7050金属封装晶振,TXC有源振荡器

7W-12.288MBE-T,7050金属封装晶振,TXC有源振荡器,12.288MHz经典音频基准频率,适配语音编码芯片,对讲模块,录音采集主板.7050金属封装屏蔽性能强,可隔绝主板电源杂波干扰,避免音频出现杂音,失真,断音问题.3.3V标准供电,上电起振迅速,-40℃至85℃宽温区间保障机房,户外设备长时间稳定工作,±25ppm精度满足音频时序同步需求.广泛应用IP对讲,车载语音模块,广播音响设备,录音工控板,保障音频采样与传输时序统一.

13-4b95-859e-64cbc7ca530b","mention_page_title":{},"external_mention_url":{}},"isKeepQuoteContainer":false,"isFromCode":false,"selection":[{"id":5,"type":"text","selection":{"start":47,"end":258},"recordId":"P2m7fM0c3dSsg8cdxnmcypkInqd"}],"payloadMap":{},"isCut":false}' data-lark-record-format="docx/text">

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: X1A000171000318,FC2012AN音叉晶振,32.768KHz宽温晶振

X1A000171000318,FC2012AN音叉晶振,32.768KHz宽温晶振,2012贴片晶振迷你封装,专为小型化低功耗设备打造.音叉晶体固有功耗极低,大幅降低设备待机电流,延长电池供电产品续航,适配电池驱动IoT终端.宽温规格优化温频特性,四季温差,设备工作升温均不会造成时钟大幅偏移,长期运行年老化漂移微弱,长期计时稳定可靠.四脚金属外壳具备屏蔽效果,抑制主板电磁干扰,避免RTC计时错乱停走.

13-4b95-859e-64cbc7ca530b","mention_page_title":{},"external_mention_url":{}},"isKeepQuoteContainer":false,"isFromCode":false,"selection":[{"id":5,"type":"text","selection":{"start":47,"end":258},"recordId":"P2m7fM0c3dSsg8cdxnmcypkInqd"}],"payloadMap":{},"isCut":false}'>

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: X1A000061000800,FC-12M晶振,数码电子晶振

X1A000061000800,FC-12M晶振,数码电子晶振,采用高精度音叉石英工艺,标准32.768kHz计时频率,负载参数适配绝大多数数码主控单片机,ESR数值低,驱动功耗微小,有效降低设备待机耗电.工作温度区间-40℃~+85℃,日常室内,轻度户外使用均可保持稳定频率输出,金属陶瓷气密封装防潮,抗震,抗温漂,适配无铅回流焊工艺.标准卷带包装适配全自动SMT贴装,出厂经过高低温循环,湿热老化可靠性检测,批次参数一致性优秀,符合RoHS环保标准,广泛用于数码相机,录音笔,学习机,小家电控制板,提供精准实时计时基准.

13-4b95-859e-64cbc7ca530b","mention_page_title":{},"external_mention_url":{}},"isKeepQuoteContainer":false,"isFromCode":false,"selection":[{"id":5,"type":"text","selection":{"start":47,"end":258},"recordId":"P2m7fM0c3dSsg8cdxnmcypkInqd"}],"payloadMap":{},"isCut":false}' data-lark-record-format="docx/text">

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: SG3225EAN100.000000M-KEGA0,LVPECL差分晶振,EPSON晶振

SG3225EAN100.000000M-KEGA0,LVPECL差分晶振,EPSON晶振,标准100MHz输出,3225六脚小型贴片封装,尺寸3.2×2.5mm适配高密度PCB布局.搭载AT切割晶片与内置PLL锁相技术,超低相位抖动,信号纯净度高,LVPECL差分输出驱动能力强,可抵消共模电磁干扰,长走线传输无失真.支持2.5V/3.3V双电压供电,内置OE输出使能引脚,工作温域覆盖-40℃~+85℃,温漂控制稳定,气密封装耐回流焊,防潮抗震.专为SFP/QSFP光模块,千兆以太网交换机打造,为SerDes高速链路提供基准时钟,大幅提升通信链路时序裕量,原厂品控严苛,批量供货稳定.

13-4b95-859e-64cbc7ca530b","mention_page_title":{},"external_mention_url":{}},"isKeepQuoteContainer":false,"isFromCode":false,"selection":[{"id":5,"type":"text","selection":{"start":47,"end":258},"recordId":"P2m7fM0c3dSsg8cdxnmcypkInqd"}],"payloadMap":{},"isCut":false}'>

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: D3SP100E00001E,HOSONIC鸿星晶振,LV-PECL差分晶振

D3SP100E00001E,HOSONIC鸿星晶振,LV-PECL差分晶振,100MHz标准频点适配高速以太网,服务器PLL,光纤收发器时序需求,差分双相信号可自动抵消线路干扰,有效降低整机EMI整改成本,满足FCC,CE电磁兼容认证要求.采用高精度石英晶片与低噪声振荡电路,全温区间相位抖动表现优异,避免高速数据传输出现眼图收缩,丢包故障,工作电压兼容2.5V,3.3V主流算力硬件供电.3225紧凑型封装平衡散热与布线空间,气密金属外壳隔绝粉尘湿气,长期运行频率老化漂移极低;出厂逐颗完成频点,抖动,输出电平全电性检测,不良率严格管控,兼容标准回流焊工艺.

132,"end":353},"recordId":"MIxyfij65d8HXwcpmv8c34NDn4e"}],"payloadMap":{},"isCut":false}' data-lark-record-format="docx/text">

13-4b95-859e-64cbc7ca530b","mention_page_title":{},"external_mention_url":{}},"isKeepQuoteContainer":false,"isFromCode":false,"selection":[{"id":5,"type":"text","selection":{"start":47,"end":258},"recordId":"P2m7fM0c3dSsg8cdxnmcypkInqd"}],"payloadMap":{},"isCut":false}' data-lark-record-format="docx/text">

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: SIT8103AI-23-33E-33.333000,SiTime陶瓷晶振,3.3V低功耗有源晶振

SIT8103AI-23-33E-33.333000,SiTime陶瓷晶振,3.3V低功耗有源晶振,精准33.333000MHz固定频点,时序精度高,相位噪声低,时钟抖动控制优异,可彻底规避高速数据传输,信号运算过程中的时序偏差,数据误码等问题.陶瓷密封封装隔热防潮,密封性极佳,全温域频率稳定性出色,无惧高低温交替,湿热环境干扰.器件起振速度快,运行全程平稳,长期连续工作无频偏,无老化失效问题,可靠性远超常规无源晶振与普通有源晶振.经过多重严苛可靠性测试,品质稳定耐用,适配工业设备晶振,精密仪器,通信设备等对时序精度要求严苛的高端应用场景.

132,"end":353},"recordId":"MIxyfij65d8HXwcpmv8c34NDn4e"}],"payloadMap":{},"isCut":false}'>

13-4b95-859e-64cbc7ca530b","mention_page_title":{},"external_mention_url":{}},"isKeepQuoteContainer":false,"isFromCode":false,"selection":[{"id":5,"type":"text","selection":{"start":47,"end":258},"recordId":"P2m7fM0c3dSsg8cdxnmcypkInqd"}],"payloadMap":{},"isCut":false}'>

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: SG3225VAN250.000000M-KEGA3,EPSON差分有源晶振,网络设备晶振

SG3225VAN250.000000M-KEGA3,EPSON差分有源晶振,网络设备晶振,250MHz高频输出搭配差分信号架构,有效抑制电磁干扰,保障高速数据传输流畅不丢包.标准3225贴片尺寸,安装便捷,契合设备小型化与规模化生产要求.功耗表现均衡,发热量低,连续运行状态稳定.凭借出色的信号完整性与驱动能力,广泛应用于交换机,光网络设备,网关等产品,是网络设备常用的高性能时钟器件.

13-4b95-859e-64cbc7ca530b","mention_page_title":{},"external_mention_url":{}},"isKeepQuoteContainer":false,"isFromCode":false,"selection":[{"id":5,"type":"text","selection":{"start":47,"end":258},"recordId":"P2m7fM0c3dSsg8cdxnmcypkInqd"}],"payloadMap":{},"isCut":false}' data-lark-record-format="docx/text">

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: SG5032VAN200.000000M-KEGA3,高频控制晶振,移动通信设备晶振

SG5032VAN200.000000M-KEGA3,高频控制晶振,移动通信设备晶振,依托LVDS差分输出特性,彻底解决高频通信场景信号衰减,杂波干扰,时序错乱等痛点.支持2.5V-3.3V标准通信电压,适配主流通信设备供电体系,电压波动下依旧稳定起振.内置OE输出使能功能,可配合设备智能休眠与信号启停控制,兼顾通信稳定性与低功耗需求,是无线通信设备高频控制系统的核心元器件.

13-4b95-859e-64cbc7ca530b","mention_page_title":{},"external_mention_url":{}},"isKeepQuoteContainer":false,"isFromCode":false,"selection":[{"id":5,"type":"text","selection":{"start":47,"end":258},"recordId":"P2m7fM0c3dSsg8cdxnmcypkInqd"}],"payloadMap":{},"isCut":false}'>

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: SG5032VAN125.000000M-KEGA3,EPSON时钟振荡器,LVDS差分晶振

SG5032VAN125.000000M-KEGA3,EPSON时钟振荡器,LVDS差分晶振,区别于常规CMOS单端晶振,差分对称输出结构具备极强的抗电磁干扰,抗串扰能力.125MHz高频稳定输出,适配千兆以太网,高速总线,图像采集,高频数据传输等对时序严苛的场景,有效解决长距离传输信号衰减,时序错乱问题.

13-4b95-859e-64cbc7ca530b","mention_page_title":{},"external_mention_url":{}},"isKeepQuoteContainer":false,"isFromCode":false,"selection":[{"id":5,"type":"text","selection":{"start":47,"end":258},"recordId":"P2m7fM0c3dSsg8cdxnmcypkInqd"}],"payloadMap":{},"isCut":false}'>

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: STC12520A-32.768KHz,8038贴片晶振,32.768KHz音叉晶振

STC12520A-32.768KHz,8038贴片晶振,32.768KHz音叉晶振,搭载32.768KHz音叉式石英晶片,凭借压电效应实现稳定振荡输出.产品频率容差控制在±20ppm以内,工作温度覆盖-40℃至+85℃工业级范围.黑色陶瓷封装兼具优良耐热性与抗干扰能力,符合RoHS环保标准,广泛应用于手机,平板电脑,电子钟表等消费电子产品,为实时时钟(RTC)模块提供精准时间基准,保障设备计时功能稳定可靠.
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: SJ18130J6-3.579545MHz,Sunny金属封装晶振,SX-A21晶振

SJ18130J6-3.579545MHz,Sunny金属封装晶振,SX-A21无源晶振,产品频率精准锁定3.579545MHz,频率容差控制在±30ppm,负载电容为8PF,采用2016汽车电子晶振封装规格(2.0mm×1.6mm),高度仅0.6mm,4-pad贴片设计适配高密度PCB布局.符合汽车级AEC-Q200认证标准,可在-40℃至85℃宽温范围稳定工作,能承受30g加速度振动冲击,专为车载娱乐系统,车身控制模块(ECU)等恶劣车载环境设计,为设备提供精准时钟基准.
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: SQ8130J6-32.000MHz,Sunny进口晶振,2520微型设备晶振

SQ8130J6-32.000MHz,Sunny进口晶振,2520微型设备晶振,32.000MHz高频特性为设备提供高效运行基准,搭配Sunny专属的电路优化设计,实现低消费电流与高稳定度的双重优势,待机功耗极低,延长便携式设备使用时长.产品具备三态输出功能可选,适配复杂电路设计需求,编带包装便于批量生产管控,是笔记本电脑,数码相机晶体,无线通讯系统的优选晶振元件.
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: 1XXB26000MAA,DSB221SDN型号晶振,KDS大真空温补晶振

1XXB26000MAA,DSB221SDN型号晶振,KDS大真空温补晶振,以微型化封装突破空间限制,助力电子设备高密度集成设计.2.5×2.0×0.9mm的超薄封装尺寸,在有限PCB空间内实现高精度温补功能,完美适配智能穿戴,智能手环设备晶振,便携式导航终端等小型化设备.26MHz标准主频可灵活适配GPS定位,物联网网关,精密仪器等各类设备,±0.5ppm的常温频率准确度的初始校准精度,配合±1ppm/年的长期稳定性,大幅降低设备运维成本.13crw9xcudUcnyd","text":{"initialAttributedTexts":{"text":{"0":"26MHz标准主频可灵活适配GPS定位、物联网网关、精密仪器等各类设备，±1.5ppm的常温频率准确度的初始校准精度，配合±1ppm/年的长期稳定性，大幅降低设备运维成本。"},"attribs":{"0":"*0+2e"}},"apool":{"numToAttrib":{"0":["author","2672291273509050"]},"nextNum":1}},"type":"text","referenceRecordMap":{},"extra":{"channel":"saas","pasteRandomId":"9545e696-034e-4ebf-85e9-6760a4ab21dd","mention_page_title":{},"external_mention_url":{}},"isKeepQuoteContainer":false,"isFromCode":false,"selection":[{"id":101,"type":"text","selection":{"start":68,"end":154},"recordId":"T6rIftQf7dO24ncN7Ttc4v4Vndh"}],"payloadMap":{},"isCut":false}' data-lark-record-format="docx/text">13crw9xcudUcnyd","text":{"initialAttributedTexts":{"text":{"0":"以微型化封装突破空间限制，助力电子设备高密度集成设计。2.5×2.0×0.9mm的超薄封装尺寸，在有限PCB空间内实现高精度温补功能，完美适配智能穿戴、便携式导航终端等小型化设备。"},"attribs":{"0":"*0+2i"}},"apool":{"numToAttrib":{"0":["author","2672291273509050"]},"nextNum":1}},"type":"text","referenceRecordMap":{},"extra":{"channel":"saas","pasteRandomId":"bced0855-e1eb-420b-b5b6-faa795307948","mention_page_title":{},"external_mention_url":{}},"isKeepQuoteContainer":false,"isFromCode":false,"selection":[{"id":100,"type":"text","selection":{"start":46,"end":136},"recordId":"Swt9fmngHdqlXycMAgPcvHMenEh"}],"payloadMap":{},"isCut":false}' data-lark-record-format="docx/text">

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